The Panasonic NPM-D3 series is a surface mount device for assembly and welding processes in the electronics manufacturing industry. It is a series of advanced SMT equipment developed by Panasonic Corporation to provide efficient and high-precision component mounting solutions. Through the use of advanced vision systems, precision mechanical structures, and intelligent control algorithms, this series of devices can automatically mount various sizes and types of surface mount components, such as IC chips, resistors, capacitors, etc., on printed circuit boards (PCBS). Its design is flexible and has high production capacity, which can meet different sizes and requirements of the production line configuration. In short, the Panasonic NPM-D3 series is a high-performance SMT device that can be widely used in the mounting process in the electronics manufacturing industry.
1. Achieve high productivity per unit area in the integrated assembly line
The Panasonic NPM-D3 series is an advanced surface mount device primarily used for assembly and welding processes in the electronics manufacturing industry. It has the following main functions and features:
1. High-precision mounting capability: NPM-D3 series equipment adopts advanced vision system and precision mechanical structure, which can realize high-precision component mounting. Through automated control and precise positioning technology, it is possible to ensure the accurate position and mount Angle of the component on the PCB (Printed Circuit Board).
2. High-speed production capacity: NPM-D3 series equipment has fast mounting speed and efficient production capacity. It adopts advanced transmission system and multi-station production line design, which can realize continuous mounting operation and greatly improve production efficiency.
3. Multiple component compatibility: NPM-D3 series devices can be applied to various sizes and types of SMT (Surface Mount Technology) components, including IC chips, resistors, capacitors, inductors, etc. At the same time, it also supports a variety of packaging forms, such as QFP, BGA, CSP, etc., to meet the mounting needs of different products.
4. Advanced quality control function: NPM-D3 series equipment is equipped with advanced visual inspection system and quality control algorithm, which can monitor quality problems in the mounting process in real time, and timely adjustment and correction. This ensures the stability and reliability of the mounting quality and reduces the defect rate.
5. Flexible production line layout: NPM-D3 series equipment supports flexible production line layout and expansion, and can be customized configuration and arrangement according to production needs. It also has a good human-computer interaction interface and friendly operation experience, which is convenient for operators to set parameters and monitor production.
In short, the Panasonic NPM-D3 series equipment is a powerful, efficient and reliable surface mount equipment for high-speed, high-precision production needs in the electronics manufacturing industry.
3. Realize the overall management of production line, production workshop and factory through system software
Support planned production through line operation monitoring
| Model： | Panasonic NPM-D3 |
| Dual Lane conveyor： | L50×W50～L510×W300 |
| Single Lane Conveyor： | L50×W50～L510×W590 |
| PCB EXCHANGE TIME | |
| Dual lane mode: | 0 sec no 0s when cycle time is 3.6 s or less |
| Single Lane Mode: | 3.6 sec when selecting short conveyors |
| Power Supply： | 3-phase AC200,220,380,400,420,480V2.7kVA |
| Mass： | 1680kg Only for main body. This differs depending on the option configuration） |
| nozzle Head： | 16 nozzle head (equipped with 2 cantilevers) ON high production mode |
| Max Speed of placement: | 84000cph (0.043s/chip) |
| (Cpk≧1) placement accuracy: | ±40μm/chip |
| component supply | |
| Bandwidth： | Tape 8/12/16/24/32/44/56mm |
| 8mm tape taping: | Max, 68 companies (8mm thin type single feeder, double tape feeder, small reel |
| Nozzle Head： | 16 nozzle head （with 2 cantilevers）OFF high production mode |
| placement speed： | 76000cph(0.047s/chip) |
| component supply | |
| Tape： | 8/12/16/24/32/44/56mm |
| 8mm tape: | Max, 68 consecutive (8mm thin single-type tape rack and double-type tape rack, small reel) |
| nozzle head： | 12nozzle head with 2 cantilevers） |
| Max Speed of placement： | 69000cph（0.052s/chip） |
| placement accuracy（Cpk≧1）： | ±30μm/chip |
| Component supply： | Component Loading |
| Tape Width： | 8/12/16/24/32/44/56mm |
| 8mm tape: | Max, 68 consecutive (8mm thin single-type tape rack and double-type tape rack, small reel) |
| Nozzle Head： | 8 nozzle head (with 2 cantilevers) |
| The fastest placement speed： | 43000cph（0.084s/chip） |
| Mounting accuracy (Cpk≧1): | ±30μm/QFP 12mm~32mm, ±50μm/QFP 12mm or less |
| Component size (mm): | 0603 chip ~ L100×W90×T28 |
| Component supply | |
| Braiding width: | 8/12/16/24/32/44/56mm |
| 8mm tape: | Max, 68 consecutive (8mm thin single-type tape rack and double-type tape rack, small reel) |
| Rod shape: | Max, 8 pieces, Pallet: Max. 20 pieces (1 pallet feeder) |
| Nozzle Head： | 2 nozzle heads (equipped with 2 cantilevers) |
| Max Speed of placement: | 11000cph (0.327s/chip) |
| IPC9850: | 8500cph (0.423s/QFP) |
| placement accuracy (Cpk≧1): | ±40μm/chip |
| Component Loading | |
| Tape Width： | 8〜56/72/88/104mm |
| 8mm Tape: | Max, 68 lines (8mm thin single-type material rack and double-type tape material rack, small reel) |
| Rod shape: Max, 8 pieces, Pallet: | Max. 20 pieces (1 pallet feeder) |
